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Conversely, the 4000-series has "borrowed" from the 7400 series – such as the CD40193 and CD40161 being pin-for-pin functional replacements for 74C193 and 74C161. Older TTL parts made by manufacturers such as Signetics , Motorola , Mullard and Siemens may have different numeric prefix and numbering series entirely, such as in the European FJ ...
IC power-supply pins are voltage and current supply terminals found on integrated circuits (ICs) in electrical engineering, electronic engineering, and integrated circuit design. [ a ] ICs have at least two pins that connect to the power rails of the circuit in which they are installed.
The first part number in the series, the 7400, is a 14-pin IC containing four two-input NAND gates. Each gate uses two input pins and one output pin, with the remaining two pins being power (+5 V) and ground. This part was made in various through-hole and surface-mount packages, including flat pack and plastic/ceramic dual in-line.
Together, the placement and routing steps of IC design are known as place and route. The task of all routers is the same. They are given some pre-existing polygons consisting of pins (also called terminals) on cells, and optionally some pre-existing wiring called preroutes. Each of these polygons are associated with a net, usually by name or ...
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
Zig-zag in-line package. The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits.It was intended as a replacement for dual in-line packaging (DIL or DIP).
Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.