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  2. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  3. Via fence - Wikipedia

    en.wikipedia.org/wiki/Via_fence

    These walls commonly form part of the device enclosure. The large holes in the via fences seen in figures 1 and 5 are screw holes for clamping these walls in place. The wall casting belonging to this circuit is shown in figure 3. [5] Figure 4. Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias.

  4. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    IPC standards revised the definition of a microvia in 2013 to a hole with depth to diameter aspect ratio of 1:1 or less, and the hole depth not to exceed 0.25mm. Previously, microvia was any hole less than or equal to 0.15mm in diameter [2]

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...

  7. Through-silicon via - Wikipedia

    en.wikipedia.org/wiki/Through-silicon_via

    In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

  8. Teardrop (electronics) - Wikipedia

    en.wikipedia.org/wiki/Teardrop_(electronics)

    Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. [ 2 ] [ 3 ] [ 5 ] An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper.

  9. JST connector - Wikipedia

    en.wikipedia.org/wiki/JST_connector

    Download as PDF; Printable version; ... Wire size Shroud Lock Notes Datasheet VH [5] 3.96 ... JST PH 2-pin right-angle through-hole PCB.

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