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The 65 nm process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.
Rio Rancho, New Mexico, U.S. 1995 upgrade 2020/2021 with 22/14 300mm, 45 nm/32 nm, Packaging Fab 12 Chandler, Arizona, U.S. 2006 300mm, 22 nm/14 nm/10 nm Fab 22 Chandler, Arizona, U.S. 2002 300mm, 22 nm/14 nm/10 nm Fab 24 Leixlip, Ireland 2006 300mm, 14 nm [3] Fab 28a Kiryat Gat, Israel 1996 300mm, 22 nm Fab 28 Kiryat Gat, Israel (2023)
Second-generation Atom processor, 32 nm. Successor to Bonnell. [53] Reference unknown. 2009 San Clemente: Chipset Intel 5100 chipset, used in two-socket servers with Xeon processors in the 65 nm Conroe and 45 nm Penryn families. San Clemente is a city in Orange County, California, USA. 2007 Sandusky Motherboard Intel D945PSN motherboard.
The mainstream 65 nanometer Core 2 Quad Q6600, clocked at 2.4 GHz, was launched on January 8, 2007 at US$851 (reduced to US$530 on April 7, 2007). July 22, 2007 marked the release of the Core 2 Quad Q6700 and Core 2 Extreme QX6850 Kentsfields at US$530 and US$999 respectively; the price of the Q6600 was later reduced to US$266. [ 2 ]
reengineered P6-based microarchitecture used in Intel Core 2 and Xeon microprocessors, built on a 65 nm process, supporting x86-64 level SSE instruction and macro-op fusion and enhanced micro-op fusion with a wider front end and decoder, larger out-of-order core and renamed register, support loop stream detector and large shadow register file.
Yonah is the code name of Intel's first generation 65 nm process CPU cores, based on cores of the earlier Banias (130 nm) / Dothan (90 nm) Pentium M microarchitecture.Yonah CPU cores were used within Intel's Core Solo and Core Duo mobile microprocessor products.
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Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or; Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman) Mobile chipset HDMI, HyperTransport 1.0 and PCI Express 1.0; DDR2-800 SO-DIMM; Mobile support Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter; Hybrid hard drives