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Technoprobe was founded in Merate near Milan in 1996 by Giuseppe Crippa, who had developed a new and more rapid method to manufacture probe cards. [2] As the company grew, it opened manufacturing and sales offices abroad, including in Rousset, France (2001), Singapore (2003), San Jose, California (2007), Philippines (2010), Korea (2015), and Japan (2018).
The company completed an initial public offering (IPO) on the Nasdaq as FORM, [2] in June 2003 with 6 million shares priced at $14. [3] [4] FormFactor released the first x64 DRAM probe card in 2000, [5] followed by the x128 DRAM probe card in 2002. [6] [7] The company shipped the first SmartMatrix full-wafer probe cards in February 2009. [8]
Probe cards are broadly classified into needle type, vertical type, and MEMS (Micro Electro-Mechanical System) [4] type depending on shape and forms of contact elements. MEMS type is the most advanced technology currently available. The most advanced type of probe card currently can test an entire 12" wafer with one touchdown.
IRVINE, Calif.--(BUSINESS WIRE)-- Probe Manufacturing, Inc., (OTC QB : PMFI), a global electronics design & manufacturing services company, ranked 9th in the Orange County Business Journal's 2012 ...
The manufacturing facility in Dongguan, Humen Town was set up in 2001 and mostly produces Spring Loaded Connectors. C.C.P. Contact Probes Co., Ltd. is listed at the Taiwanese Stock Exchange (ISIN TW0006217003). In 2016, it had approximately NTD1,892.3 million(~USD60 million) revenue and a Net Income of NTD159.3 million (~USD5.15 million).
On June 15, 2009, Verigy acquired Touchdown Technologies, a privately held company that designs, manufactures, and supports advanced Microelectromechanical systems probe cards to support the wafer test needs of semiconductor manufacturers worldwide. On November 18, 2010, Verigy announced its intent to merge with LTX-Credence.
the probe card may be damaged from repeated contact, or become contaminated with debris created by contact with the wafer [2] the probe will act as a circuit and affect the results of the test. For this reason, the tests performed at wafer sort cannot always be identical and as extensive as those performed at the final device test after ...
Since then, Duberstein has enjoyed lucrative posts on countless boards of directors. He has served on the boards of Boeing (1997-present), Dell (2011-present) and ConocoPhillips (2000-2012). Duberstein made nearly $3.9 million in compensation between 2008 and 2012 from these companies.