Search results
Results from the WOW.Com Content Network
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
Visualizing via-first, via-middle and via-last TSVs. Dictated by the manufacturing process, there exist three different types of TSVs: via-first TSVs are fabricated before the individual component (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), via-middle TSVs are fabricated after the individual component are patterned but before the metal layers (back-end ...
The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.
Users can tell the difference between a message sent via SMS and one sent over iMessage as the bubbles will appear either green (SMS) or blue (iMessage). The desktop Messages application replaced iChat as the native OS X instant messaging client with the release of OS X Mountain Lion in July 2012. [210]
The receiving circuit responds to the difference between the two signals, which results in a signal with a magnitude twice as large. The symmetrical signals of differential signalling may be referred to as balanced , but this term is more appropriately applied to balanced circuits and balanced lines which reject common-mode interference when ...
Upgrade to a faster, more secure version of a supported browser. It's free and it only takes a few moments:
A viaduct is a specific type of bridge that consists of a series of arches, piers or columns supporting a long elevated railway or road. Typically a viaduct connects two points of roughly equal elevation, allowing direct overpass across a wide valley, road, river, or other low-lying terrain features and obstacles.
The difference between now and the past is that such a decision is available not simply to 16-to-18-year-old high school recruits, who are also easily swayed by things like jersey colors ...