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  2. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  3. Values in Action Inventory of Strengths - Wikipedia

    en.wikipedia.org/wiki/Values_in_Action_Inventory...

    The VIA-IS is a 96-question measure of 24 character strengths. On average, an individual will complete the VIA-IS in 10 to 15 minutes. (Previous versions of 240 and 120 questions were criticized for their length.{{[4])

  4. List of VIA chipsets - Wikipedia

    en.wikipedia.org/wiki/List_of_VIA_chipsets

    VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.

  5. Through-silicon via - Wikipedia

    en.wikipedia.org/wiki/Through-silicon_via

    In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

  6. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    The ANOVA results showed that the strain concentration factor was the most important variable, followed with the ductility factor, metallization thickness, and via wall angle. Prabhu et al. [ 10 ] conducted a finite element analysis (FEA) on an HDI microvia structure to determine the effect of accelerated temperature cycling and thermal shock.

  7. Texans WR Diontae Johnson not expected to play vs. Ravens ...

    www.aol.com/sports/texans-wr-diontae-johnson-not...

    — #Texans WR Diontae Johnson, just acquired via waivers, is planning to make his Houston debut in Week 18 vs. the #Titans. Today is too quick. — Ian Rapoport (@RapSheet) December 25, 2024.

  8. Via fence - Wikipedia

    en.wikipedia.org/wiki/Via_fence

    A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.

  9. AOL Mail

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!