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Aluminising vacuum chamber at Mont Mégantic Observatory used for re-coating telescope mirrors. [1] Vacuum deposition is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can ...
The VLS process takes place as follows: A thin (~1–10 nm) Au film is deposited onto a silicon (Si) wafer substrate by sputter deposition or thermal evaporation. The wafer is annealed at temperatures higher than the Au-Si eutectic point, creating Au-Si alloy droplets on the wafer surface (the thicker the Au film, the larger the droplets).
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film.
The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm/min at relatively low substrate temperatures, with very high material utilization efficiency. The ...
Vacuum became a valuable industrial tool in the 20th century with the introduction of incandescent light bulbs and vacuum tubes, and a wide array of vacuum technologies has since become available. The development of human spaceflight has raised interest in the impact of vacuum on human health, and on life forms in general.
Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films .
Ion plating (IP) is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a modified version of vacuum deposition. Ion plating uses concurrent or periodic bombardment of the substrate, and deposits film by atomic-sized energetic particles called ions.