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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Laser drilling. Laser drilling is the process of creating thru-holes, referred to as “popped” holes or “percussion drilled” holes, by repeatedly pulsing focused laser energy on a material. The diameter of these holes can be as small as 0.002” (~50 μm). If larger holes are required, the laser is moved around the circumference of the ...
Helium–silver (HeAg) metal-vapor laser: 224.3 nm Scientific research Strontium vapor laser: 430.5 nm Scientific research Neon–copper (NeCu) metal-vapor laser: 248.6 nm Electrical discharge in metal vapor mixed with neon buffer gas. Scientific research: Raman and fluorescence spectroscopy: Copper vapor laser: 510.6 nm, 578.2 nm
Selective laser melting ( SLM) is one of many proprietary names [1] for a metal additive manufacturing (AM) technology that uses a bed of powder with a source of heat to create metal parts. Also known as direct metal laser sintering ( DMLS ), the ASTM standard term is powder bed fusion ( PBF ). PBF is a rapid prototyping, 3D printing, or ...
Laser beam machining ( LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
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