Search results
Results from the WOW.Com Content Network
Fujitec Co., Ltd. (フジテック株式会社, Fujitekku Kabushiki-gaisha) is a Japanese elevator manufacturer. Fujitec was founded by late Honorary Chairman, Mr. Shotaro Uchiyama in February 1948 for the purpose of research and development, manufacturing, sales, installation and maintenance of elevators, escalators and travellators.
Joint IED Neutralizer (JIN): In 2005, Ionatron attempted to develop an anti IED device that would "zap" IEDs from a distance by using lasers to ionize the air and allow man-made lightning to shoot towards the devices detonating them at a safe distance. By using femtosecond lasers light pulses that last less than a ten-trillionth of a second JIN ...
These foils are made in a range of thicknesses, e.g. 60, 80, 100, and 150 micrometers. The flame front propagation rate ranges generally between 7.5–9 m/s. The reaction temperature can reach up to 1500 °C for a millisecond. The energy released is approximately 1200 to 1300 joules per gram. [2]
The Mars Reconnaissance Orbiter (MRO) entered safe mode on August 26, 2009 for the second incident in a month, the fourth in 2009 and the eighth since launch in 2005. [9] [10] The spacecraft was kept in safe mode until December 8, 2009. [11] Kepler entered safe mode on June 15 and again on July 3, 2009. Both cases were triggered by an on-board ...
Reactive armour is a type of vehicle armour used in protecting vehicles, especially modern tanks, against shaped charges and hardened kinetic energy penetrators. The most common type is explosive reactive armour (ERA), but variants include self-limiting explosive reactive armour (SLERA), non-energetic reactive armour (NERA), non-explosive ...
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .
If and when a "fail-safe" system fails, it remains at least as safe as it was before the failure. [1] [2] Since many types of failure are possible, failure mode and effects analysis is used to examine failure situations and recommend safety design and procedures. [3] Some systems can never be made fail-safe, as continuous availability is needed.
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]