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Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [13] Low-temperature eutectic solder with high strength. [12] Particularly strong, very brittle. [11] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature
Soft soldering is characterized by having a melting point of the filler metal below approximately 400 °C (752 °F), [9] whereas silver soldering and brazing use higher temperatures, typically requiring a flame or carbon arc torch to achieve the melting of the filler.
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
Low vapor pressure, suitable for vacuum work. Good ductility. Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: Au 88 Ge 12: Au 356 [54] – Au88, Indalloy 183, Premabraze 880, Georo. Eutectic. Low ductility. Used for die attachment of some chips. The high temperature may be detrimental to the chips and ...
Brazing and soldering processes classification chart [7] ... Alloys with larger span of solidus/liquidus temperatures tend to melt through a "mushy" state, during ...
Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T mp = 456 K) at 115 °C would have comparable mechanical properties to copper (T mp = 1358 K) at 881 °C, because they would both be at 0.85T mp despite being at ...
Lead-free solder glasses with soldering temperature of 450 °C (842 °F) were also developed. Phosphate glasses with low melting temperature were developed. One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with addition of lithium and some other oxides. [19] Electrically conductive glass solders can be also ...