enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

3. Thermal management (electronics) - Wikipedia

   en.wikipedia.org/wiki/Thermal_management...

   Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

4. Fin (extended surface) - Wikipedia

   en.wikipedia.org/wiki/Fin_(extended_surface)

   Thus, adding a fin to an object, increases the surface area and can sometimes be an economical solution to heat transfer problems. One-piece finned heat sinks are produced by extrusion, casting, skiving, or milling.

5. Computer cooling - Wikipedia

   en.wikipedia.org/wiki/Computer_cooling

   A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

6. Thermal management of high-power LEDs - Wikipedia

   en.wikipedia.org/wiki/Thermal_management_of_high...

   Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.

7. Thermal interface material - Wikipedia

   en.wikipedia.org/wiki/Thermal_interface_material

   A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).