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A heat sink (also commonly spelled heatsink,[1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.
Thermal paste is designed to fill imperfections on the surface of a chip. Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is ...
Thermal conductivity and resistivity. The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or and is measured in W·m −1 ·K −1. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
In heat transfer, thermal engineering, and thermodynamics, thermal conductance and thermal resistance are fundamental concepts that describe the ability of materials or systems to conduct heat and the opposition they offer to the heat current. The ability to manipulate these properties allows engineers to control temperature gradient, prevent ...
Thermal conduction (power) is the heat per unit time transferred some distance ℓ between the two temperatures. κ is the thermal conductivity of the material. A is the cross-sectional area of the object. ΔT is the difference in temperature from one side to the other. ℓ is the length of the path the heat has to be transferred.
A hot, less-dense lower boundary layer sends plumes of hot material upwards, and cold material from the top moves downwards. Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such ...
The general definition of the heat transfer coefficient is: where: : heat flux (W/m²); i.e., thermal power per unit area, : difference in temperature between the solid surface and surrounding fluid area (K) The heat transfer coefficient is the reciprocal of thermal insulance. This is used for building materials (R-value) and for clothing ...
The heat generated dissipates into the sample on both sides of the sensor, at a rate depending on the thermal transport properties of the material. By recording temperature vs. time response in the sensor, the thermal conductivity, thermal diffusivity and specific heat capacity of the material can be calculated.