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2. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

3. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.

4. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

5. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

6. List of brazing alloys - Wikipedia

   en.wikipedia.org/wiki/List_of_brazing_alloys

   For iron or nickel alloys. Silver-white color; used in silversmithing due to color match. Low zinc content minimizes zinc evaporation, especially in controlled atmospheres during fluxless brazing. 22: 3: 75: Ag 50 Cu 34 Zn 16: Ag–Cu–Zn 675/775 [41] 677/774 [53] – BAg-6, Braze 501, Braze 502, Braze 503, Silvaloy A50, Silver Braze 50. For ...

7. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   For example, tin-lead solder [5] attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.