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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

4. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

5. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.

6. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F). Extra-hard solder has 80% silver and melts at 740 °C (1,370 °F). If multiple joints are needed, then the jeweler will start with hard or extra-hard solder and switch to lower-temperature solders for later joints. Silver solder is somewhat absorbed by the ...

7. Printed circuit board manufacturing - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board...

   An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste. Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless ...