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About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. [56] Sn 60 Pb 39 Cu 1: Pb: No: Sn 60 Pb 38 Cu 2: 183: 190 [16] [17] Pb: Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
A fusible alloy is a metal alloy capable of being easily fused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily, eutectic alloys. Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 183 °C (361 °F; 456 K). Fusible alloys in this sense are used for solder.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Example of a copper alloy object: a Neo-Sumerian "Foundation Nail" of Gudea, circa 2100 BC, made in the lost-wax cast method, overall: 17.5 x 4.5 x 7.3 cm, probably from modern-day Iraq, now in the Cleveland Museum of Art (Cleveland, Ohio, USA) Copper alloys are metal alloys that have copper as their principal component.
The solder used in the process can vary in composition, with different alloys used for different applications. Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead.
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that transform directly from solid to liquid state, or vice versa from liquid to solid state, at a specific composition and temperature without ...
Hiduminium or R.R. alloys (2% copper, iron, nickel): used in aircraft pistons Hydronalium (up to 12% magnesium, 1% manganese): used in shipbuilding, resists seawater corrosion Italma (3.5% magnesium, 0.3% manganese): formerly used to make coinage of the Italian lira