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CTBGA: thin chip array ball grid array; CVBGA: very thin chip array ball grid array; DSBGA: die-size ball grid array; FBGA: fine ball grid array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs; also known as fine pitch ball grid array (JEDEC-Standard [9]) or fine line BGA by Altera.
Also known as laminate ball-grid array [3] TEPBGA: Thermally-enhanced plastic ball-grid array: CBGA: Ceramic ball-grid array [3] OBGA: Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA: Plastic ball-grid array [3] MAP-BGA: Mold array process - ball-grid array : UCSP: Micro (μ) chip-scale package: Similar to a BGA (A ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory.Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...