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  2. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and populating them with electronic components. It includes all the processes to produce the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  4. Chip on board - Wikipedia

    en.wikipedia.org/wiki/Chip_on_board

    The PCB of a quartz watch. The clock IC is under the drop of black epoxy. Chip on board (COB) is a method of circuit board manufacturing in which integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1]

  5. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.

  6. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    The basic equipment used during the process is a conveyor that moves the PCB through the different zones, a pan of solder used in the soldering process, a pump that produces the actual wave, the sprayer for the flux and the preheating pad. The solder is usually a mixture of metals.

  7. Component placement - Wikipedia

    en.wikipedia.org/wiki/Component_placement

    Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

  8. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  9. Occam process - Wikipedia

    en.wikipedia.org/wiki/Occam_process

    The Occam process is a solder-free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in circuit board manufacturing developed by Verdant Electronics. It combines the usual two steps of constructing printed circuit boards (PCBs) followed by the population process of placing various leaded and non-leaded electronic ...

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