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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Left: individual linear polymer chains Right: Polymer chains which have been cross linked to give a rigid 3D thermoset polymer. In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (). [1]
This is a list of insulation materials used around the world.. Typical R-values are given for various materials and structures as approximations based on the average of available figures and are sorted by lowest value.
Rigid panel insulation, also known as continuous insulation [13] can be made from foam plastics such as polyisocyanurate or polystyrene, or from fibrous materials such as fiberglass, rock and slag wool. Rigid panel continuous insulation is often used to provide a thermal break in the building envelope, thus reducing thermal bridging.
The gases/fluids filling these gaps may largely influence the total heat flow across the interface. The thermal conductivity of the interstitial material and its pressure, examined through reference to the Knudsen number, are the two properties governing its influence on contact conductance, and thermal transport in heterogeneous materials in ...