enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Die (manufacturing) - Wikipedia

   en.wikipedia.org/wiki/Die_(manufacturing)

   The cutting surface of the die is the edge of hardened steel strips, known as steel rule. These steel rules are usually located using saw or laser-cut grooves in plywood. The mating die can be a flat piece of hardwood or steel, a male shape that matches the workpiece profile, or it can have a matching groove that allows the rule to nest into ...

3. Die preparation - Wikipedia

   en.wikipedia.org/wiki/Die_preparation

   Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.

4. Die cutting (web) - Wikipedia

   en.wikipedia.org/wiki/Die_cutting_(web)

   Rotary die cutting is die cutting using a cylindrical die on a rotary press and may be known as a rotary die cutter or RDC. A long sheet or web of material will be fed through the press into an area known as a "station" which holds a rotary tool that will cut out shapes, make perforations or creases, or even cut the sheet or web into smaller parts.

5. Lead frame - Wikipedia

   en.wikipedia.org/wiki/Lead_frame

   Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.

6. Die (integrated circuit) - Wikipedia

   en.wikipedia.org/wiki/Die_(integrated_circuit)

   A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .

7. Semiconductor device fabrication - Wikipedia

   en.wikipedia.org/wiki/Semiconductor_device...

   After the dies are tested for functionality and binned, they are packaged. Plastic or ceramic packaging involves mounting the die, connecting the die/bond pads to the pins on the package, and sealing the die. Tiny bondwires are used to connect the pads to the pins. In the 'old days' (1970s), wires were attached by hand, but now specialized ...