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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
The ANOVA results showed that the strain concentration factor was the most important variable, followed with the ductility factor, metallization thickness, and via wall angle. Prabhu et al. [ 10 ] conducted a finite element analysis (FEA) on an HDI microvia structure to determine the effect of accelerated temperature cycling and thermal shock.
It is common to run TSO in batch (as opposed to interactively): all the usual TSO line-mode interactive commands can be also executed via Job Control Language (JCL) by running any of the programs IKJEFT01, IKJEFT1A, and IKJEFT1B and supplying the line commands in a file pointed to by the SYSTSIN DD. The primary difference between the three ...
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Electronic modulation was developed between 1832 and 1927 and was a crucial development in the history of telecommunications. Electronic multiplexing, which allowed for the transmission of multiple signals over a single channel, was first developed in 1853 using a technique called time-division multiplexing (TDM). [ 12 ]
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Some countries, such as the United Kingdom, do not distinguish between the two, but others make a distinction; for example, Germany uses the words Kreuz ("cross") or Dreieck ("triangle") for the former and Ausfahrt ("exit") for the latter. In all cases one road crosses the other via a bridge or a tunnel, as opposed to an at-grade crossing.
The difference between now and the past is that such a decision is available not simply to 16-to-18-year-old high school recruits, who are also easily swayed by things like jersey colors ...