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PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.
In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side ...
Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. [2] [3] [5] An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper. [3]
DipTrace is a proprietary software suite for electronic design automation (EDA) used for electronic schematic capture and printed circuit board layouts. DipTrace has four applications: schematic editor, PCB editor with built-in shape-based autorouter and 3D preview, component editor (schematic symbol), and pattern editor (PCB footprint).
Ogunjimi et al. [9] looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace (conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angle, ductility coefficient of the conductor material, and strain concentration factor ...
Kraig Mitzner, Complete PCB Design Using OrCAD Capture and PCB Editor, Newnes, 2009 ISBN 0-08-094354-3. Jing Li, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-free Environment, ProQuest, 2007 ISBN 0-549-32110-1.
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