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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
Electronics cooling: Thermal resistance is crucial for designing heat sinks and thermal management systems in electronic devices to prevent overheating. Calculating thermal conductance is crucial for designing effective heat sinks and cooling systems in electronic devices.
To better understand the problem we must remember the basic concepts underlying Thermal management and Computer cooling. [26] Let’s consider the thermal conduction path from the CPU case to the ambient air through a Heat sink, with: Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink.
Computer cooling is a sub-topic. Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow.
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