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Desktop platform combining the Sandy Bridge CPU with the P67 (Cougar Point) chipset. Reference unknown. 2010 Sunnymead Motherboard Intel D945GSU motherboard. MicroBTX form factor, 945G chipset . OEM board for Dell. Reference unknown. 2005 Sunrise Lake I/O processor Intel IOP348 I/O processor. Reference uncertain. 2007 Sunset Highway VRM
Block diagram of the Platform Controller Hub–based chipset architecture, including an Integrated Memory Controller (IMC) in the CPU An Intel DH82H81 PCH with its die exposed The Platform Controller Hub ( PCH ) is a family of Intel 's single-chip chipsets , first introduced in 2009.
[citation needed] Most of the time memory modules, located close to CPU will receive enough of the air flow from the case or CPU fan, even if the air from CPU fan and radiator is warm. If the main CPU is water cooled, this small amount of airflow might be missing, and additional care about some airflow in a case or a dedicated memory cooling is ...
A fan controller with LEDs indicating fan status and potentiometers and switches to control fan speeds. Another method, popular with PC hardware enthusiasts, is the manual fan speed controller. They can be mounted in an expansion slot or a 5.25" or 3.5" drive bay or come built into a computer's case. Using switches or knobs, attached fans can ...
View of the socket LGA 1155 on an Intel Core i7 Sandy Bridge 2600K model CPU Celeron G530 "Sandy Bridge" installed on a Socket 1155. LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (second generation core) and Ivy Bridge (third generation) microarchitectures.
The Freezer line of coolers is available in different fan speed, cooling capacity and motherboard compatibility [3] to cater the needs of different type of users from HTPC users to enthusiasts and overclockers. The Freezer series CPU coolers are designed to lower the temperature inside your computer to enhance the stability and lifespan of the ...
Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of the cooling fan.
Granite Rapids dies are connected using Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technique which is Intel's alternative to TSMC's Infinity Fan-Out (InFO) packaging technique. [14] Rather than use a traditional silicon interposer, EMIB embeds a silicon bridge within an organic substrate to connect multiple dies.
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