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  2. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    The flip-chip joint can be eutectic, high-lead, lead-free solder or gold stub. The primary source of light comes from the back side of the LED chip, and there is usually a built-in reflective layer between the light emitter and the solder joints to reflect up the light which is emitted downward.

  3. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

  5. RoHS - Wikipedia

    en.wikipedia.org/wiki/RoHS

    The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]

  6. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.

  7. Solder fatigue - Wikipedia

    en.wikipedia.org/wiki/Solder_fatigue

    Compositional differences lead to variations in phase(s), grain size, and intermetallics. This affects susceptibility to deformation mechanisms such as dislocation motion, diffusion, and grain boundary sliding. During thermal cycling, the solder's microstructure (grains/phases) will tend to coarsen [5] as energy is

  8. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Additionally, tin is a more corrosive metal, and can eventually lead to the failure of solder baths [clarification needed]. [36] Lead-free construction has also extended to components, pins, and connectors. Most of these pins used copper frames, and either lead, tin, gold or other finishes. Tin finishes are the most popular of lead-free finishes.

  9. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g. titanium liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder is prohibited in critical applications, such as aerospace, military and medical projects, because joints are likely ...

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