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  2. Ferroelectric RAM - Wikipedia

    en.wikipedia.org/wiki/Ferroelectric_RAM

    The much larger sales of flash memory compared to the alternative NVRAMs support a much larger research and development effort. Flash memory is produced using semiconductor linewidths of 30 nm at Samsung (2007) while FeRAMs are produced in linewidths of 350 nm at Fujitsu and 130 nm at Texas Instruments (2007).

  3. Fully Buffered DIMM - Wikipedia

    en.wikipedia.org/wiki/Fully_Buffered_DIMM

    Memory controller with differential serial connections to DDR2 FB-DIMMs. The AMB is visible in the center of each DIMM. A Fully Buffered DIMM (FB-DIMM) is a type of memory module used in computer systems. It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller ...

  4. Framebuffer - Wikipedia

    en.wikipedia.org/wiki/Framebuffer

    A frame buffer may be designed with enough memory to store two frames worth of video data. In a technique known generally as double buffering or more specifically as page flipping, the framebuffer uses half of its memory to display the current frame. While that memory is being displayed, the other half of memory is filled with data for the next ...

  5. Honeywell 6000 series - Wikipedia

    en.wikipedia.org/wiki/Honeywell_6000_series

    6000-series systems were said to be "memory oriented" — a system controller in each memory module arbitrated requests from other system components (processors, etc.). Memory modules contained 128 K words of 1.2 μs 36-bit words ; a system could support one or two memory modules for a maximum of 256 K words (1 MB of 9-bit bytes).

  6. CAMM (memory module) - Wikipedia

    en.wikipedia.org/wiki/CAMM_(memory_module)

    Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]

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  8. Compute Express Link - Wikipedia

    en.wikipedia.org/wiki/Compute_Express_Link

    Type 3 (CXL.io and CXL.mem) – allow the host to access and manage attached device memory, memory expansion boards and persistent memory. Devices provide host CPU with low-latency access to local DRAM or byte-addressable non-volatile storage. [38] Type 2 devices implement two memory coherence modes, managed by device driver.

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