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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
A fluid reservoir to store the main supply of coating fluid for the system; A pump to drive the coating fluid through the system; A slot-die to distribute the coating fluid across the desired coating width before coating onto the substrate; A substrate mounting system to support the substrate in a controlled manner as it moves through the system
Since the foundation of the company GMA in 1989, which emerged from the former Elektromat, in Sacka near Dresden, Suss Microtec has been producing its own systems for testing micro components. In 1993, Suss Microtec expanded its product range with the acquisition of the French S.E.T. to include spin coaters and device bonders.
There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.
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The wafer is covered with photoresist liquid by spin coating. Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer. In this way, any 'bump' or 'ridge' of resist is removed, leaving a very flat layer.
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