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Advanced Microelectronics Packaging and Interconnection (smaller, faster, more powerful, and cost-competitive). Hardware Systems Engineering (tools and methodologies for cost-efficient, up-front design of advanced electronic systems, including modelling and design-for-test techniques to improve cost, yield, quality, and time-to-market).
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
He is known for his work on phase-change heat/mass transfer with droplets and bubbles, multi-phase flows, buoyancy-driven transport, and ionized arc-plasma transport with applications in condensation, combustion, microelectronic packaging, and micro-/macro-biological systems. [3] He is the recipient of the 2014 Max Jakob Memorial Award.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
The dies can then undergo further assembly and packaging. [4] Within fabrication plants, the wafers are transported inside special sealed plastic boxes called FOUPs. [3] FOUPs in many fabs contain an internal nitrogen atmosphere [5] [6] which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring. [7]
Micromachining, semiconductor processing, microelectronic fabrication, semiconductor fabrication, MEMS fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term.
2.5D integration – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a single package 3D integration – an advanced semiconductor technology that incorporates multiple layers of circuitry into a single chip, integrated both vertically and horizontally