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2. Arrow Lake (microprocessor) - Wikipedia

   en.wikipedia.org/wiki/Arrow_Lake_(microprocessor)

   At CES in January 2024, Intel stated that Arrow Lake would launch for desktop in the second half of 2024. [9] Intel claimed that Arrow Lake would be the "world's first gaming processor with an AI accelerator" despite AMD's Ryzen 8000G desktop APUs, codenamed "Phoenix-G", with a dedicated XDNA AI engine launching first in January 2024. [10]

3. List of AMD Ryzen processors - Wikipedia

   en.wikipedia.org/wiki/List_of_AMD_Ryzen_processors

   All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds. All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core.

4. Zen 5 - Wikipedia

   en.wikipedia.org/wiki/Zen_5

   Zen 5 ("Nirvana") [1] is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [2] launched for mobile in July 2024 and for desktop in August 2024. [3] It is the successor to Zen 4 and is currently fabricated on TSMC 's N4X process. [ 4 ]

5. List of Intel processors - Wikipedia

   en.wikipedia.org/wiki/List_of_Intel_processors

   Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.

6. LGA 1851 - Wikipedia

   en.wikipedia.org/wiki/LGA_1851

   The revealed socket Contacts of the Intel Core Ultra 9 285K (left, LGA 1851), and i9-14900K (right, Socket 1700). LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024.

7. Raptor Lake - Wikipedia

   en.wikipedia.org/wiki/Raptor_Lake

   The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.