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The LPX form factor power supply eventually formed the basis for the ATX form factor power supply, which is the same width and height. The specification was very popular in the early-mid 1990s, and briefly displaced the AT form factor as the most commonly used.
Reliability, availability and serviceability (RAS), also known as reliability, availability, and maintainability (RAM), is a computer hardware engineering term involving reliability engineering, high availability, and serviceability design. The phrase was originally used by IBM as a term to describe the robustness of their mainframe computers.
In engineering, reliability, availability, maintainability and safety (RAMS) [1] [2] is used to characterize a product or system: . Reliability: Ability to perform a specific function and may be given as design reliability or operational reliability
RAMP Simulation Software for Modelling Reliability, Availability and Maintainability (RAM) is a computer software application developed by WS Atkins specifically for the assessment of the reliability, availability, maintainability and productivity characteristics of complex systems that would otherwise prove too difficult, cost too much or take too long to study analytically.
The first generation rechargeable alkaline batteries were introduced by Union Carbide and Mallory in the early 1970s. [3] [5] Several patents were introduced after Union Carbide's product discontinuation and eventually, in 1986, Battery Technologies Inc of Canada was founded to commercially develop a 2nd generation product based on those patents, under the trademark "RAM".
The RAM slots and the PCI slots are parallel to each other. Processor is placed closest to the fan. May contain a CNR board. MicroBTX (or uBTX) Intel 2004 264 × 267 mm max (10.4 × 10.5 in) MicroBTX (also called uBTX) is a computer motherboard form factor.
LPX can mean: Landing Platform eXperimental, a classification of warship characterized by the South Korean LPX Dokdo; Liepāja International Airport; LPX (form factor), motherboard standard; Lean Packet Exchange protocol, an Ethernet protocol used to communicate with the variant Network Direct Attached Storage (NDAS) of NetDisk.
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory.