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  2. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

  4. Land grid array - Wikipedia

    en.wikipedia.org/wiki/Land_grid_array

    LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]

  5. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...

  6. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).

  7. Multi-chip module - Wikipedia

    en.wikipedia.org/wiki/Multi-chip_module

    A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...

  8. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    A plastic dual-in-line package containing an analog integrated circuit.This can be installed in a socket or directly soldered to a printed circuit board. A low current thyristor and a high power device, with a threaded stud for attachment to a heat sink, and a flexible lead; such packages are used for devices rated for hundreds of amperes.

  9. Distribution board - Wikipedia

    en.wikipedia.org/wiki/Distribution_board

    A distribution board (also known as panelboard, circuit breaker panel, breaker panel, electric panel, fuse box or DB box) is a component of an electricity supply system that divides an electrical power feed into subsidiary circuits while providing a protective fuse or circuit breaker for each circuit in a common enclosure.

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