Search results
Results from the WOW.Com Content Network
support for Ryzen 5000 Vermeer, Ryzen 4000G Renoir with 300 chipset October 2021 1.2.0.2 stability fixes March 2021 1.2.0.1 stability fixes February 2021 1.2.0.0 support for Vermeer, Renoir, Cezanne with 400 chipset January 2021 1.1.9.0 Curve Optimizer for undervolting and overclocking: 1.1.0.0d support for 400 chipset December 2020 1.1.0.0c
Common features of Ryzen 5000 notebook APUs: Socket: FP6. All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: TSMC 7FF.
Common features of Ryzen 5000 desktop CPUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. L1 cache: 64 KB per core (32 KB data + 32 KB instruction). L2 cache: 512 KB per core. Fabrication process: TSMC 7FF.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Startup Optimizer uses research-based classifications to automatically detect unneeded startup items, while allowing all the important programs and services to load. Program Accelerator™ This feature uses patented calibration technology to realign program files for the fastest possible access.
Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...
Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.