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A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...
But they can also be caused by bus errors introduced by other failing components, like memory or I/O devices. Possible causes include: Poor CPU cooling due to a CPU heatsink and case fans (or filters) that's clogged with dust or has come loose. Overclocking beyond the highest clock rate at which the CPU is still reliable. Failing motherboard.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:
Examples of are the temperature of hot steam entering the turbine of a steam power plant, or the temperature at which the fuel burns in an internal combustion engine. T C {\\displaystyle T_{\\rm {C}}} is usually the ambient temperature where the engine is located, or the temperature of a lake or river into which the waste heat is discharged.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
A CPU shim. A CPU shim (also called CPU spacer) is a shim used between the CPU and the heat sink in a computer. Shims make it easier and less risky to mount a heatsink on the processor because it stabilizes the heatsink, preventing accidental damaging of the fragile CPU packaging. [1] They help distribute weight evenly over the surface.