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  2. Strain engineering - Wikipedia

    en.wikipedia.org/wiki/Strain_engineering

    Strain can be induced in thin films with either epitaxial growth, or more recently, topological growth. Epitaxial strain in thin films generally arises due to lattice mismatch between the film and its substrate and triple junction restructuring at the surface triple junction, which arises either during film growth or due to thermal expansion mismatch. [5]

  3. Stranski–Krastanov growth - Wikipedia

    en.wikipedia.org/wiki/Stranski–Krastanov_growth

    While initial film growth follows an FM mechanism, i.e. positive differential μ, nontrivial amounts of strain energy accumulate in the deposited layers. At a critical thickness, this strain induces a sign reversal in the chemical potential, i.e. negative differential μ, leading to a switch in the growth mode.

  4. Stiffening - Wikipedia

    en.wikipedia.org/wiki/Stiffening

    Mechanical methods for stiffening include tension stiffening, [2] centrifugal stiffening, [3] bracing, superstructure bracing, substructure bracing, straightening, strain stiffening, stress stiffening, [4] damping vibrations, swelling, pressure increasing, drying, cooling, interior reinforcing, exterior reinforcing, wrapping, surface treating ...

  5. Deformation mechanism - Wikipedia

    en.wikipedia.org/wiki/Deformation_mechanism

    Fracture processes "grind"/"roll"/"slide" grains past each other creating the rounded appearance of the individual grains. Cataclasis, or comminution, is a non-elastic brittle mechanism that operates under low to moderate homologous temperatures, low confining pressure and relatively high strain rates.

  6. Strain (mechanics) - Wikipedia

    en.wikipedia.org/wiki/Strain_(mechanics)

    In mechanics, strain is defined as relative deformation, compared to a reference position configuration. Different equivalent choices may be made for the expression of a strain field depending on whether it is defined with respect to the initial or the final configuration of the body and on whether the metric tensor or its dual is considered.

  7. Stress–strain analysis - Wikipedia

    en.wikipedia.org/wiki/Stress–strain_analysis

    Stress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics , stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other ...

  8. Strain hardening exponent - Wikipedia

    en.wikipedia.org/wiki/Strain_hardening_exponent

    The strain hardening exponent (also called the strain hardening index), usually denoted , is a measured parameter that quantifies the ability of a material to become stronger due to strain hardening. Strain hardening (work hardening) is the process by which a material's load-bearing capacity increases during plastic (permanent) strain , or ...

  9. Deformation (engineering) - Wikipedia

    en.wikipedia.org/wiki/Deformation_(engineering)

    This is not true since the actual area will decrease while deforming due to elastic and plastic deformation. The curve based on the original cross-section and gauge length is called the engineering stress–strain curve, while the curve based on the instantaneous cross-section area and length is called the true stress–strain curve. Unless ...