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  2. Castigliano's method - Wikipedia

    en.wikipedia.org/wiki/Castigliano's_method

    Castigliano's method for calculating displacements is an application of his second theorem, which states: If the strain energy of a linearly elastic structure can be expressed as a function of generalised force Q i then the partial derivative of the strain energy with respect to generalised force gives the generalised displacement q i in the direction of Q i.

  3. Standard linear solid model - Wikipedia

    en.wikipedia.org/wiki/Standard_Linear_Solid_model

    where σ is the applied stress, E is the Young's modulus of the material, and ε is the strain. The spring represents the elastic component of the model's response. [2] Dashpots represent the viscous component of a viscoelastic material. In these elements, the applied stress varies with the time rate of change of the strain:

  4. Stress–strain analysis - Wikipedia

    en.wikipedia.org/wiki/Stress–strain_analysis

    Stress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics , stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other ...

  5. Strain (mechanics) - Wikipedia

    en.wikipedia.org/wiki/Strain_(mechanics)

    In mechanics, strain is defined as relative deformation, compared to a reference position configuration. Different equivalent choices may be made for the expression of a strain field depending on whether it is defined with respect to the initial or the final configuration of the body and on whether the metric tensor or its dual is considered.

  6. Strain engineering - Wikipedia

    en.wikipedia.org/wiki/Strain_engineering

    Strain can be induced in thin films with either epitaxial growth, or more recently, topological growth. Epitaxial strain in thin films generally arises due to lattice mismatch between the film and its substrate and triple junction restructuring at the surface triple junction, which arises either during film growth or due to thermal expansion mismatch. [5]

  7. von Mises yield criterion - Wikipedia

    en.wikipedia.org/wiki/Von_Mises_yield_criterion

    Strain energy density consists of two components - volumetric or dialational and distortional. Volumetric component is responsible for change in volume without any change in shape. Distortional component is responsible for shear deformation or change in shape.

  8. Rainflow-counting algorithm - Wikipedia

    en.wikipedia.org/wiki/Rainflow-counting_algorithm

    The method successively extracts the smaller interruption cycles from a sequence, which models the material memory effect seen with stress-strain hysteresis cycles. [1] This simplification allows the number of cycles until failure of a component to be determined for each rainflow cycle using either Miner's rule to calculate the fatigue damage ...

  9. Deformation (engineering) - Wikipedia

    en.wikipedia.org/wiki/Deformation_(engineering)

    This is not true since the actual area will decrease while deforming due to elastic and plastic deformation. The curve based on the original cross-section and gauge length is called the engineering stress–strain curve, while the curve based on the instantaneous cross-section area and length is called the true stress–strain curve. Unless ...

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