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The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Ryzen 5 Pro 3350GE: 3.3 3.9 Radeon Graphics 640:40:16 10 CU 1200 1536 35 W Jul 21, 2020: Ryzen 5 Pro 3350G: 4 (8) 3.6 4.0 1300 1830.4 65 W Ryzen 5 3400GE: 3.3 Vega 11 704:44:16 11 CU 35 W Jul 7, 2019: Ryzen 5 Pro 3400GE: Sep 30, 2019: Ryzen 5 3400G: 3.7 4.2 RX Vega 11 1400 1971.2 65 W Jul 7, 2019: US $149 [85] Ryzen 5 Pro 3400G: Vega 11 Sep 30 ...
An AMD Ryzen 5 2600 Die shot of a Ryzen 3 1200. Zen series CPUs and APUs (released 2017) Summit Ridge Ryzen 1000 series (desktop) Whitehaven Ryzen Threadripper 1000 series (desktop) Raven Ridge Ryzen 2000 APU series with RX Vega (desktop & laptop) and Athlon APU series with Radeon Vega (desktop & laptop)
Ryzen 3 4300U 4 No 2700 (3700 boost) 4 MB Mobile: Socket FP6. Desktop: Socket AM4. Mobile: Dual-channel DDR4 or LPDDR4. Desktop: Dual-channel DDR4. Ryzen 3 (4300G, 4300GE, 4350G, 4350GE, Pro 4450U) Yes 2500–3800 (3700–4200 boost) Ryzen 5 4500U 6 No 2300 (4000 boost) 8 MB Ryzen 5 (4600U, Pro 4650U, 4600H, 4600HS, 4680U),
Single or Dual-core 64-bit processors codenamed Conesus, ... 2.3 GHz: 512 KB: 64-bit: 1.6 GHz: 11.5× ... Ryzen 5 5600U [note 1] [40] 6 (12) 2.3 4.2 1 × 6 1.8
The Athlon 64 X2 is the first native dual-core desktop central processing unit (CPU) designed by Advanced Micro Devices (AMD). It was designed from scratch as native dual-core by using an already multi-CPU enabled Athlon 64, joining it with another functional core on one die, and connecting both via a shared dual-channel memory controller/north bridge and additional control logic.
DDR4 SO-DIMMs have 260 pins instead of the 204 pins of DDR3 SO-DIMMs, spaced at 0.5 rather than 0.6 mm, and are 2.0 mm wider (69.6 versus 67.6 mm), but remain the same 30 mm in height. [ 54 ] For its Skylake microarchitecture , Intel designed a SO-DIMM package named UniDIMM , which can be populated with either DDR3 or DDR4 chips.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
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