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PC2-5300 DDR2 SO-DIMM (for notebooks) Comparison of memory modules for desktop PCs (DIMM) Comparison of memory modules for portable/mobile PCs (SO-DIMM) The key difference between DDR2 and DDR SDRAM is the increase in prefetch length. In DDR SDRAM, the prefetch length was two bits for every bit in a word; whereas it is four bits in DDR2 SDRAM.
USB flash drive: Various USB 1.1/2.0/3.0/3.1 2000/2001 1 TB+ (not to scale) Universally compatible across most non-mobile computer platforms, their greater size suits them better to file transfer/storage instead of use in portable devices
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
The device came with a hard drive of 250 GB, 320 GB, 500 GB, 640 GB or 750 GB and 4 GB 1066 MHz of DDR3 SDRAM. It was able to support up to 8 GB of RAM. It was able to support up to 8 GB of RAM. It came with the Windows 7 Professional operating system and also featured an HDMI port, three USB 2.0 ports, one VGA port, and one RJ-45 Ethernet port.
Normally, there is a performance penalty for using registered memory. Each read or write is buffered for one cycle between the memory bus and the DRAM, so the registered RAM can be thought of as running one clock cycle behind the equivalent unregistered DRAM. With SDRAM, this only applies to the first cycle of a burst.
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
The Linux kernel has supported USB mass-storage devices since version 2.3.47 [3] (2001, backported to kernel 2.2.18 [4]).This support includes quirks and silicon/firmware bug workarounds as well as additional functionality for devices and controllers (vendor-enabled functions such as ATA command pass-through for ATA-USB bridges, used for S.M.A.R.T. or temperature monitoring, controlling the ...
However, the SuperSpeed USB part of the system still implements the one-lane Gen 1×1 operation mode. Therefore, two-lane operations, namely USB 3.2 Gen 1×2 (10 Gbit/s) and Gen 2×2 (20 Gbit/s), are only possible with Full-Featured USB-C. As of 2023, they are somewhat rarely implemented; Intel, however, started to include them in its 11th ...
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