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  2. Solder mask - Wikipedia

    en.wikipedia.org/wiki/Solder_mask

    Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.

  3. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    A PCB with red solder mask and white silkscreen A PCB with green solder mask and yellow silkscreen. Areas that should not be soldered may be covered with solder resist (solder mask). The solder mask is what gives PCBs their characteristic green color, although it is also available in several other colors, such as red, blue, purple, yellow ...

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    For its function in helping to prevent solder shorts, the coating is called solder resist or solder mask. The pattern to be etched into each copper layer of a PCB is called the "artwork". The etching is usually done using photoresist which is coated onto the PCB, then exposed to light projected in the pattern of the artwork. The resist material ...

  5. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  6. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Film coatings ranging from 0.100 to 76 μm can be applied in a single operation. The coating thickness is uniform, even on irregular surfaces. Desired contact points, such as battery contacts or connectors, must be covered with an air-tight mask to prevent the parylene from coating the contacts. Applying parylene is a batch process that does ...

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

  8. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste printed on a PCB. Solder paste is typically used in a stencil-printing process by a solder paste printer, [6] in which paste is deposited over a stainless steel or polyester mask to create the desired pattern on a printed circuit board.

  9. Stencil printing - Wikipedia

    en.wikipedia.org/wiki/Stencil_Printing

    The mask must be centered correctly. The mask protects the PWB against oxidation, and prevents unintended solder bridges from forming between closely spaced solder pads. Also the height of the solder mask should be lower than the pad height to avoid gasketing problems. If the height of the solder mask is greater than that of the pad, then some ...

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