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A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...
Good solder joints between BGA and PCB. Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for testing, and cannot be desoldered ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
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Head-in-pillow defects, or incomplete coalescence of ball grid array (BGA) sphere and solder paste deposit, is a failure mode that has seen increased frequency since the transition to lead-free soldering.
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