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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

4. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.

5. Land grid array - Wikipedia

   en.wikipedia.org/wiki/Land_grid_array

   The land grid array is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. [2]

6. Head-in-pillow defect - Wikipedia

   en.wikipedia.org/wiki/Head-in-pillow_defect

   For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...

7. Bead probe technology - Wikipedia

   en.wikipedia.org/wiki/Bead_probe_technology

   Solder paste is applied to the location and reflowed. During reflow, solder flows and is drawn to the copper trace. Surface tension causes the bead to have a curved surface and rise above the solder mask, where it solidifies into a Bead Probe. The bead will be roughly obround in shape and may be 15-25 mils long. A properly constructed bead is ...

8. AOL Mail

   mail.aol.com

   Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

9. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste. Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless ...