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An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board (PCB).. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors ...
Mixed-signal or hybrid circuits contain elements of both analog and digital circuits. Examples include comparators, timers, phase-locked loops, analog-to-digital converters, and digital-to-analog converters. Most modern radio and communications circuitry uses mixed signal circuits.
Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication ) of very small electronic designs and components. Usually, but not always, this means micrometre-scale or smaller.
One such device is the hybrid silicon laser, in which the silicon is bonded to a different semiconductor (such as indium phosphide) as the lasing medium. [41] Other devices include all-silicon Raman laser [42] or an all-silicon Brillouin lasers [43] wherein silicon serves as the lasing medium.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
Modern surface-mount electronic components on a printed circuit board, with a large integrated circuit at the top. Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other electrically charged particles.
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Full hybrid-pi model. The full model introduces the virtual terminal, B′, so that the base spreading resistance, r bb, (the bulk resistance between the base contact and the active region of the base under the emitter) and r b′e (representing the base current required to make up for recombination of minority carriers in the base region) can be represented separately.