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2. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   The solder volume is a function of the stencil, the printing process and equipment, solder powder, and rheology or the physical properties of the paste. Good solder wetting is a function of the flux. Inputs

3. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

4. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer .

5. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   While solder paste can be manufactured using any size range, there has been a move towards finer particle sizes, especially for fine feature stencil printing. [2] Finer particle sizes places added pressure on the solder paste flux to remove surface oxides, which leaves the outside of the joint not fully coalesced, producing the irregular ...

6. Thick-film technology - Wikipedia

   en.wikipedia.org/wiki/Thick-film_technology

   Screen-printing is the process of transferring an ink through a patterned woven mesh screen or stencil using a squeegee. [8] For improving accuracy, increasing integration density and improving line and space accuracy of traditional screen-printing photoimageable thick-film technology has been developed. Use of these materials however changes ...

7. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

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   mail.aol.com

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9. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.