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2. TO-220 - Wikipedia

   en.wikipedia.org/wiki/TO-220

   TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.

3. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   A pin fin heat sink with a Z-clip retainer Wire form Z-clips. More expensive than tape and epoxy, wire form z-clips attach heat sinks mechanically. To use the z-clips, the printed circuit board must have anchors. Anchors can be either soldered onto the board, or pushed through. Either type requires holes to be designed into the board.

4. TO-126 - Wikipedia

   en.wikipedia.org/wiki/TO-126

   Front and back of a transistor in a TO-126 package. TO-126 is a type of semiconductor package for devices with three pins, such as transistors. [1] The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink.

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