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Intel is hitting CES 2023 with some serious swagger, announcing a new line of mobile processors including what it says is the world’s fastest chip for a laptop.The company’s 13th-generation ...
The Snapdragon 8 Elite is Qualcomm’s latest top-of-the-line mobile processor and includes improved performance and power efficiency thanks to the company’s use of what it calls Prime Cores ...
Snapdragon is a suite of system-on-chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm, who often refers to these SoCs as "mobile platforms". They typically integrate central processing units (CPU) based on the ARM architecture , a graphics processing unit (GPU), some digital signal processors (DSP), and may ...
Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues.
Most Windows Phone 7.0 devices (excluding LG Optimus), Acer Stream/Liquid, Acer neoTouch S200, Dell Streak, Fujitsu Toshiba Mobile REGZA Phone T-01C, HP Compaq AirLife 100, HTC Desire, HD2, Nexus One, Huawei SmaKit S7, Lenovo LePhone, LG Optimus Q, Optimus Z, Panther, Pantech IM-A600S, IM-A650S, Sharp Lynx (SH-10B), Lynx 3D (SH-03C), Sony ...
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
[4] [5] [6] The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021, [ 7 ] mobile CPUs and non-K series desktop CPUs on January 4, 2022, [ 8 ] Alder Lake-P and -U series on February 23, 2022, [ 9 ] and Alder Lake-HX series on May ...
AMD mobile Initial platform Mobile processor: Processors Single or Dual-core 64-bit processors codenamed Conesus, with the following: made on 65 nm process; 15W (single-core) or 18W (dual-core) TDP; 27 mm (W) × 27 mm (D) × 2.5 mm(H) BGA package, named "ASB1" low voltage processors; DDR2 SO-DIMM; Mobile chipset: AMD RS780M series chipset ...