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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
Slot-die coating is a non-contact coating method, in which the slot-die is typically held over the substrate at a height several times higher than the target wet film thickness. [23] The coating fluid transfers from the slot-die to the substrate via a fluid bridge that spans the air gap between the slot-die lips and substrate surface.
There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.
A BARC coating (Bottom Anti-Reflectant Coating) may be applied before the photoresist is applied, to avoid reflections from occurring under the photoresist and to improve the photoresist's performance at smaller semiconductor nodes such as 45 nm and below. [25] [26] [27] Top Anti-Reflectant Coatings (TARCs) also exist. [28]
The precursor sol can be either deposited on a substrate to form a film (e.g., by dip-coating or spin coating), cast into a suitable container with the desired shape (e.g., to obtain monolithic ceramics, glasses, fibers, membranes, aerogels), or used to synthesize powders (e.g., microspheres, nanospheres). [1]
Dip coating is similar to spin coating in that a liquid precursor or sol-gel precursor is deposited on a substrate, but in this case the substrate is completely submerged in the solution and then withdrawn under controlled conditions. By controlling the withdrawal speed, the evaporation conditions (principally the humidity, temperature) and the ...
Spin casting is a favored method for fabricating items in the specified materials – low temperature metals and thermoset plastics. Compared to the two main competing processes, injection molding and (zinc) die-casting, spin casting has significant advantages in terms of startup cost and ease of use.
SU-8 molecule. SU-8 is a commonly used epoxy-based negative photoresist.Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development.