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Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands. The expansion of trapped moisture can result in internal separation (delamination) of the plastic from the die or lead-frame, wire bond damage, die damage, and internal cracks. Most of this ...
An antistatic bag is a bag used for storing electronic components, which are prone to damage caused by electrostatic discharge (ESD). These bags are usually plastic polyethylene terephthalate (PET) and have a distinctive color (silvery for metallised film , pink or black for polyethylene ).
The building materials industry also manages the moisture barrier properties in architectural components to ensure the correct moisture levels in the internal spaces of buildings. Optoelectronic devices based on organic material, generally named OLEDs , need an encapsulation with low values of WVTR to guarantee the same performances over the ...
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Humidity indicator cards are also present on many small electronic devices, ranging from cellular phones to laptop computers, for the purpose of alerting the manufacturer that the device has been exposed to high levels of moisture. In many cases this voids or changes the terms of warranty coverage for the device. [2]
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
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