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  2. Deposition (phase transition) - Wikipedia

    en.wikipedia.org/wiki/Deposition_(phase_transition)

    For deposition to occur, thermal energy must be removed from a gas. When the air becomes cold enough, water vapour in the air surrounding a leaf loses enough thermal energy to change into a solid. Even though the air temperature may be below the dew point, the water vapour in the air alone may not condense spontaneously. This supercooled water ...

  3. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    PVD process flow diagram. Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from ...

  4. Wegener–Bergeron–Findeisen process - Wikipedia

    en.wikipedia.org/wiki/Wegener–Bergeron...

    The Wegener–Bergeron–Findeisen process (after Alfred Wegener, Tor Bergeron, and Walter Findeisen []), (or "cold-rain process") is a process of ice crystal growth that occurs in mixed phase clouds (containing a mixture of supercooled water and ice) in regions where the ambient vapor pressure falls between the saturation vapor pressure over water and the lower saturation vapor pressure over ice.

  5. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]

  6. Atomic layer deposition - Wikipedia

    en.wikipedia.org/wiki/Atomic_layer_deposition

    There, the starting surface contains hydroxyls (OH groups) as reactive sites; Step 1 is the reaction of TMA; Step 2 is a purge or evacuation step, Step 3 is the reaction of water, and Step 4 is a purge or evacuation step. [1] Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical ...

  7. Evaporation - Wikipedia

    en.wikipedia.org/wiki/Evaporation

    Aerosol of microscopic water droplets suspended in the air above a cup of hot tea after the water vapor has sufficiently cooled and condensed. Water vapor is an invisible gas, but the clouds of condensed droplets refract and scatter the sunlight and are thus visible. Droplets of water vapor in a pan. Demonstration of evaporative cooling.

  8. Ultra-high-purity steam for oxidation and annealing - Wikipedia

    en.wikipedia.org/wiki/Ultra-high-purity_steam...

    Water vapor can be the source of oxygen for the generation of oxides as well as a humidifier for dry gases in sputtering, spin-on and ALD processes. In the semiconductor and MEMS industries, Rapid Thermal Processing (RTP) and Diffusion need high flow rates of water vapor for short periods of time. The move to larger wafers and higher ...

  9. Vapor–liquid–solid method - Wikipedia

    en.wikipedia.org/wiki/Vapor–liquid–solid_method

    The vapor–solid, vapor–liquid, and liquid–solid interfacial energies play a key role in the shape of the droplets and therefore must be examined before choosing a suitable catalyst; small contact angles between the droplet and solid are more suitable for large area growth, while large contact angles result in the formation of smaller ...