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2. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   In contrast to using traditional bars or coiled wires of all-metal solder and manually applying flux to the parts being joined, much hand soldering since the mid-20th century has used flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous bodies of inorganic acid or rosin flux embedded lengthwise inside it.

3. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Properly done, the iron heats the parts to be connected, which in turn melt the solder, guaranteeing adequate heat in the joined parts for thorough wetting. If using solder wire with an embedded flux core, heating the solder first may cause the flux to evaporate before it cleans the surfaces being soldered.

5. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. [56] Sn 60 Pb 39 Cu 1: Pb: No: Sn 60 Pb 38 Cu 2: 183: 190 [16] [17] Pb: Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten ...

6. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux. Thereafter, the solder melts. The time in this area is known as Time Above Liquidus. A reasonably ...

7. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]