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  2. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  4. List of Superfund sites in New Jersey - Wikipedia

    en.wikipedia.org/wiki/List_of_Superfund_sites_in...

    In New Jersey, the Department of Environmental Protection's (NJDEP) Site Remediation Program oversees the Superfund program. As of 16 August 2024 [update] , there are 115 Superfund sites listed on the National Priorities List (NPL).

  5. Through-hole technology - Wikipedia

    en.wikipedia.org/wiki/Through-hole_technology

    Through-hole devices mounted on the circuit board of a mid-1980s home computer.Axial-lead devices are at upper left, while blue radial-lead capacitors are at upper right Close-up view of an electronic circuit board showing component lead holes (gold-plated) with through-hole plating up the sides of the hole to connect tracks on both sides of the board.

  6. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron

  7. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]

  8. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...

  9. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.