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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
Gap 0.05–0.15 mm. White color; often chosen for silver or stainless steel due to excellent color match. Maximum service temperature 204 °C (intermittently 316 °C ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
An ingot of 0.5 kg (1.1 lb) ... Indium sheets are sometimes used for cold-soldering in microwave ... typically in an alloy of 80% silver, 15% indium, and 5% ...
Decarburizing, AWS type 2, "endothermic generated atmospheres. 70–71% N 2, 5–6% CO 2, 9–10% CO, 14–15% H 2. For copper, silver, copper-phosphorus and copper-zinc filler metals. For brazing copper, brass, nickel alloys, Monel, medium carbon steels. Combusted fuel gas
The two metals are completely miscible as liquids but not as solids; their importance in industry comes from the fact that their properties tend to be suitable over a wide range of variation in silver and copper concentration, although most useful alloys tend to be richer in silver than the eutectic mixture (71.9% silver and 28.1% copper by ...
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