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On 6 October 2021, the PCI Express 6.0 revision 0.9 specification (a "final draft") was released. [105] On 11 January 2022, PCI-SIG officially announced the release of the final PCI Express 6.0 specification. [106] On 18 March 2024, Nvidia announced Nvidia Blackwell GB100 GPU, the world's first PCIe 6.0 GPU. [107]
On August 2, 2022, the CXL Specification 3.0 was released, based on PCIe 6.0 physical interface and PAM-4 coding with double the bandwidth; new features include fabrics capabilities with multi-level switching and multiple device types per port, and enhanced coherency with peer-to-peer DMA and memory sharing.
PCI Express 5.0 (×16 link) [40] 512 Gbit/s: 63.02 GB/s: 2019 NVLink 1.0: 640 Gbit/s: 80 GB/s: 2016 PCI Express 6.0 (×16 link) [41] 968 Gbit/s: 121 GB/s: 2022 CXL Specification 3.0 & 3.1 (×16 link) 968 Gbit/s: 121 GB/s: 2022, 2023 NVLink 2.0: 1.2 Tbit/s: 150 GB/s: 2017 PCI Express 7.0 (×16 link) 1.936 Tbit/s: 242 GB/s: 2025 Infinity Fabric ...
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.
It has produced the PCI, PCI-X and PCI Express specifications. As of 2024, the board of directors of the PCI-SIG has representatives from: AMD, ARM, Dell EMC, IBM, Intel, Synopsys, Keysight, NVIDIA, and Qualcomm. The chairman and president of the PCI-SIG is Al Yanes, a "Distinguished Engineer" from IBM.
The M.2 specification provides up to four PCI Express lanes and one logical SATA 3.0 (6 Gbit/s) port, and exposes them through the same connector so both PCI Express and SATA storage devices may exist in the form of M.2 modules.
The specification would be based on the PCI Express interface and NVM Express protocol. On 18 April 2017 the CompactFlash Association published the CFexpress 1.0 specification. [2] Version 1.0 will use the XQD form-factor (38.5 mm × 29.8 mm × 3.8 mm) with two PCIe 3.0 lanes for speeds up to 2 GB/s. NVMe 1.2 is used for low-latency access, low ...
The most commonly used pin outs are Type 6 and Type 10. The latest pin-out added in revision 3.0 of the COM Express specification (available from www.picmg.org) is Type 7. The Type 7 provides up to four 10 GbE interfaces and up to 32 PCIe lanes, making COM Express 3.0 appropriate for data center, server, and high-bandwidth video applications.